Exhibitor & Sponsor Opportunities:

The 2013 Packaging Conference
Ritz Carlton - Buckhead, Atlanta

 

2013 Sponsors

Evening Reception After Hours Bonus Session Luncheon and Tour
 Indorama Logo  Sidel, Inc.

 

2013 Exhibitors

 

 Cannon Instruments Company Bericap Steinfurth
Nissei ASB Company Chipsco Valspar Corporation
MOCON, Inc. MoldMasters, Inc. Printing Systems LLC
R&D Leverage Penn Color z-moulds
KHS Agr International, Inc. UNA-DYN a Piovan Company
 Rinco Ultrasonics Amcor Rigid Plastics SACMI Imola
Systech Illinois Wentworth Mold GEA Procomac
ALPS ILLIG L.P. USA Sidel, Inc.
Indorama Ventures USA, Inc. Qsat Ingenieria SATAKE-USA, Inc.
Plastic Technologies, Inc. SBA-CCI, Inc. Phoenix Technologies International LLC
Container Science, Inc. Purac  

 

Download the exhibitor & sponsor guide here.

Why Exhibit or Sponsor at the 2013 Packaging Conference? 

In these tough economic times directed and focused marketing expenditures are critical. During the conference we offer a cost effective marketing opportunity having direct access to your core markets — while you watch it happen. This is an opportunity to return to the personal one-to-one marketing approach.

Sponsorship Opportunities:

We are pleased to offer to a select few companies the opportunity to become a sponsor of our conference. Sponsors will receive publicity on our website and in multiple mailings, advertising and printed material. This conference and the sponsorship opportunities are designed to target a focused audience of senior packaging professionals. Placement will be commensurate with the level of sponsorship.

Exhibition Opportunities:

We are pleased to offer a select group of industry professionals an opportunity to participate in the Exhibition for Business Opportunities. We will be offering limited number of tabletop displays in the conference area on a first come, first-served basis where businesses can showcase their equipment, products and technologies. Our exhibitor’s package includes a table in the display area — in premium locations for maximum visibility with a special focus on providing networking opportunities and one registration to the conference

For More Information Please Contact:

Sharon Davis

Phone: +1 (904) 940-7723

Email: s.davis@thepackagingconference.com